存储模块选型-SAMSUNG
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| Partnumber | Production Status | Density | Package Size | Temperature(°C) | Version | MLC | Application |
| KLM8G1GESD-B03P | Mass Production | 8GB | 11.5x13x0.8 | -40°C ~ 85°C | 5.0 | 2bit MLC | Automotive |
| KLM8G1GESD-B03Q | Mass Production | 8GB | 11.5x13x0.8 | -40°C ~ 105°C | 5.0 | 2bit MLC | Automotive |
| KLMAG2GESD-B03P | Mass Production | 16GB | 11.5x13x0.8 | -40°C ~ 85°C | 5.0 | 2bit MLC | Automotive |
| KLMAG2GESD-B03Q | Mass Production | 16GB | 11.5x13x0.8 | -40°C ~ 105°C | 5.0 | 2bit MLC | Automotive |
| KLMBG4GESD-B03P | Mass Production | 32GB | 11.5x13x1.0 | -40°C ~ 85°C | 5.0 | 2bit MLC | Automotive |
| KLMBG4GESD-B03Q | Mass Production | 32GB | 11.5x13x1.0 | -40°C ~ 105°C | 5.0 | 2bit MLC | Automotive |
| KLMCG8GESD-B03P | Mass Production | 64GB | 11.5x13x1.0 | -40°C ~ 85°C | 5.0 | 2bit MLC | Automotive |
| KLMCG8GESD-B03Q | Mass Production | 64GB | 11.5x13x1.0 | -40°C ~ 105°C | 5.0 | 2bit MLC | Automotive |
| KLM8G1GESD-B04P | Customer Sample | 8GB | 11.5x13x0.8 | -40°C ~ 85°C | 5.1 | 2bit MLC | Automotive |
| KLM8G1GESD-B04Q | Customer Sample | 8GB | 11.5x13x0.8 | -40°C ~ 105°C | 5.1 | 2bit MLC | Automotive |
| KLMAG2GESD-B04P | Customer Sample | 16GB | 11.5x13x0.8 | -40°C ~ 85°C | 5.1 | 2bit MLC | Automotive |
| KLMAG2GESD-B04Q | Customer Sample | 16GB | 11.5x13x0.8 | -40°C ~ 105°C | 5.1 | 2bit MLC | Automotive |
| KLMBG4GESD-B04P | Customer Sample | 32GB | 11.5x13x1.0 | -40°C ~ 85°C | 5.1 | 2bit MLC | Automotive |
| KLMBG4GESD-B04Q | Customer Sample | 32GB | 11.5x13x1.0 | -40°C ~ 85°C | 5.1 | 2bit MLC | Automotive |
| KLMCG8GESD-B04P | Customer Sample | 64GB | 11.5x13x1.0 | -40°C ~ 85°C | 5.1 | 2bit MLC | Automotive |
| KLMCG8GESD-B04Q | Customer Sample | 64GB | 11.5x13x1.0 | -40°C ~ 105°C | 5.1 | 2bit MLC | Automotive |
创建时间：2016-10-21 13:54
